Why Intel Retiree Medical Plan Trust
FY2024 · Form 990Its mission and biggest programs, as filedProvides health coverage for retired US employees and their dependents.
- Provide Medical benefits for eligible retired employees of Intel corporation and their dependents$53.5M spent in FY2024
Before you apply
FY2024 · Form 990Independent: from IRS data, not the orgAbout the role
The org's own posting, as writtenJob Details:
Job Description
The Role and Impact We are seeking a Silicon Packaging Design Architect to join our team, where you will drive end-to-end package solutions for physical, electrical, and cost requirements. In this senior engineering role, you will collaborate with cross-functional teams to design, troubleshoot, and continuously improve packaging standards and processes, ensuring high-quality package output. Your contributions will directly impact the seamless transition of designs to production and enhance Intel's advanced packaging technologies.
Business Group As part of Intel Corporation's dynamic and innovative ecosystem, this role resides within the Silicon Packaging Architecture team, focused on developing advanced packaging solutions that enable Intel's cutting-edge silicon technologies. The team plays a vital role in ensuring packaging, and 3D IC designs meet technical, mechanical, and reliability standards while supporting Intel's broader mission to drive world-changing advancements in technology.
Key Responsibilities
Translate product requirements into detailed package architecture specifications. Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards. Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks. Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards. Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions.
Implement co-design strategies between silicon and board design teams to optimize product performance and cost. Collaborate with EDA partners to advance package design tools and optimize design methods. Core Competencies Strong analytical, communication, and organizational skills. Proven ability to manage multiple priorities and deadlines in a dynamic environment.
Qualifications
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
US Citizenship required. Ability to obtain and maintain US Government TS/SCI Security Clearance with Polygraph. Option 1: Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science or in a STEM related role with 6+ years of experience. Option 2: Master's degree in electrical engineering, mechanical engineering, chemical engineering, materials science or in a STEM related role with 4+ years of experience. Option 3: Ph.D. in electrical engineering, mechanical engineering, chemical…
About Intel Retiree Medical Plan Trust
From its Form 990- Budget $67.5M
- founded 1996
- Open jobs 300 · Jobs at Intel Retiree Medical Plan Trust · Full 990 report